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Our MCP solutions provide a variety of product and density combinations, configurations and package options, which helpful in saving the cost and minimizing foot print of the PCB. At the same time, our MCP solutions provide high reliability and fast time-to-market advantage for a variety applications.

*NAND MCP (NAND + DDR/SDR)

Den NAND Org DRAM Org Part Number Voltage Temp. Range ECC
PKG(mm) Function
1G/256 x8,x16

x16,x32

FMN1xx6xBx

1.7V~1.95V

-40℃~85℃

4bit

107B (10.5x13)130B (8x9)137B (10.5x13)

Page=2KB+64B

1G/512

x8,x16

x16,x32

FMN1xx5xBx

1.7V~1.95V

-40℃~85℃

4bit

107B (10.5x13)130B (8x9)137B (10.5x13)

Page=2KB+64B

2G/512 x8,x16

x16,x32

FMN2xx5xBx

1.7V~1.95V

-40℃~85℃

1bit

130B (8x9)137B

Page=2KB+64B

2G/1G x8,x16

x16,x32

FMN2xx1xBx

1.7V~1.95V

-40℃~85℃

4bit

107B (10.5x13)130B (8x9)137B (10.5x13)

Page=2KB+64B/128B